Just an addition to the reflow vs. resolder ideas, neither work if any impurities exist not allowing the solder to "wet". That is why many do the desolder witha wick or vacuum device-reflux-new solder.
FWIW What also must be added is that most pads, that is, the circuit board solder area, can be lifted off the circuit board by too much heat. A technique that gets the connecting lead hot enough to flow the solder and transitioning the heat to the pad in a wiping motion resulting in a cohesive flow on both is best. When doing an eyelet, the goal is still to keep the heat evenly distributed that the whole assembly heats at the same rate without overheating either part.