Dear vigilante,
Hope you're well. I concur: if there's a "dry" joint - where the solder never bonded properly - then there's no alternative, but to remove the failed solder, prep the surface carefully, and re-solder.
On these MCC units, the solder joints develop micro-cracks, as the solder heats and cools repeatedly, over many years. Re-flowing the solder, closes the micro-cracks, and current flows.
Your comments as to the correct method to apply solder - witout overheating the board - are most helpful and should go into the site's FAQs.
Yours faithfully,
Spook
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